
ACQUISITIONS & CONTRACTS
University of Michigan to Use EVG Wafer Bonders
The school's Lurie Nanofabrication Facility will use the technology for advanced MEMS research. continued
MARKET RESEARCH
The Future of the Smart Grid
The Research and Markets report looks beyond the smart meter to demonstrations, technology development, and upcoming trends. continued
DALSA Ranked Leading MEMS Foundry
Market research firm Yole Developpement placed DALSA in the top position because of the company's revenue growth in 2009. continued
NEW TECHNOLOGIES and products
ZigBee Offers Downloads of Wireless Standards
The open-source home automation and remote control application profiles are now available to the public. continued
Teledyne Infrared Sensors Survey the Universe
The company's megapixel imaging devices will be at the heart of NASA's Wide-Field Infrared Survey Explorer, which will scan the sky to view stars, luminous galaxies, and near-Earth asteroids and comets. continued
TI Introduces RF Range Extender
The device is well suited for highly integrated, low-power wireless applications, operating in the 850 to 950 MHz frequency range, and works with TI's sub-1 GHz transceivers, transmitters, and systems-on-chip. continued
PAIRINGS & PARTNERSHIPS
Flexpoint and SPI to Collaborate
The two companies have entered a working relationship to develop a "nip sensor," which will measure contact, or interfacial, pressure and distribution between two mating or impacting surfaces in manufacturing and research and development applications. continued
Modius and RF Code Form Partnership
The companies will integrate RF Code's wire-free environmental sensor-based monitoring system with the Modius OpenData platform. continued
Triune Systems and SFT to Collaborate
The green technology supplier will use SFT's 3D extraction software to optimize its devices' design, power consumption, and reliability. continued
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