
AWARDS
Canesta Awarded 37th Patent for is CMOS 3D Sensor Tech
The Enabler III wireless platform will be used to link Enabler devices in the taxis with existing enterprise applications. continued
ACQUISITIONS & CONTRACTS
ADI Acquires Tech for Smart-Grid Energy Applications
Analog Devices Inc. acquires Domosys' PowerBUS RHINO power-line carrier technology to enable commercialization of metering communications products. continued
Fortress Supports Wireless Reach-Back Project
The company will undertake the project to support improved information transfer (voice, video, and data) for training ranges for the U.S. Marine Corps. continued
Army Corps of Engineers Taps Honeywell
Selection marks second large contract to reduce utility bills and emissions, and improve federal facilities. continued
NEW TECHNOLOGIES and products
“Fog Pilot” Project for CALTRANS, CHP
Using Proxim Wireless and ICx technologies, the California Dept. of Transportation and the California Highway Patrol, provide life-saving integrated weather detection and traffic safety system to reduce deadly accidents caused by fog and extreme weather. continued
3M Touch Systems Intros Surface Capacitive Touch System
The MicroTouch SCT System is designed for 5.7 in. to 12.1 in. displays for retail and consumer applications. continued
Leadis Temperature Compensation Engine for License
The company has opened its LED "In-Situ" temperature compensation engine for licensing to third parties. continued
GE Announces Diesel Particulate Filter Soot Sensor
The ACCUSOLVE DPF soot sensor is the first in a line of sensors to help reduce emissions and improve fuel economy for diesel engines. continued
PAIRINGS & PARTNERSHIPS
EF Johnson Technologies, Inc. Joins ISA100
Company joins industry forum responsible for industrial wireless standards.
continued
EF Johnson, Honeywell Enter Long-Term Supply Agreement
EF Johnson Technologies will provide secure, environmentally hardened broadband access points to Honeywell Process Solutions for its industrial process controls. continued
Léti and Brewer Science Create a Common Lab
Under the agreement, the companies will collaborate on new 3-D stacking and MEMS process flows. continued
|